JPH0530361Y2 - - Google Patents

Info

Publication number
JPH0530361Y2
JPH0530361Y2 JP1988023665U JP2366588U JPH0530361Y2 JP H0530361 Y2 JPH0530361 Y2 JP H0530361Y2 JP 1988023665 U JP1988023665 U JP 1988023665U JP 2366588 U JP2366588 U JP 2366588U JP H0530361 Y2 JPH0530361 Y2 JP H0530361Y2
Authority
JP
Japan
Prior art keywords
semiconductor
insulating film
constant temperature
temperature storage
conductive pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988023665U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01127238U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988023665U priority Critical patent/JPH0530361Y2/ja
Publication of JPH01127238U publication Critical patent/JPH01127238U/ja
Application granted granted Critical
Publication of JPH0530361Y2 publication Critical patent/JPH0530361Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP1988023665U 1988-02-23 1988-02-23 Expired - Lifetime JPH0530361Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988023665U JPH0530361Y2 (en]) 1988-02-23 1988-02-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988023665U JPH0530361Y2 (en]) 1988-02-23 1988-02-23

Publications (2)

Publication Number Publication Date
JPH01127238U JPH01127238U (en]) 1989-08-31
JPH0530361Y2 true JPH0530361Y2 (en]) 1993-08-03

Family

ID=31242848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988023665U Expired - Lifetime JPH0530361Y2 (en]) 1988-02-23 1988-02-23

Country Status (1)

Country Link
JP (1) JPH0530361Y2 (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0758725B2 (ja) * 1990-01-19 1995-06-21 株式会社東芝 半導体ウェハ
JP5509871B2 (ja) * 2010-01-22 2014-06-04 トヨタ自動車株式会社 着座シート

Also Published As

Publication number Publication date
JPH01127238U (en]) 1989-08-31

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